Sn50Pb50 Lead-Containing Solder Bar
Excellent wettability to reduce defective solder joints. Minimal harmful impurities to enhance diffusivity.
Sn50Pb50 Lead-Containing Solder Bar
Product Model: Sn50Pb50
Melting Point: 183-216℃
Operating Temperature: 270-290℃
Product Material: 50% Tin (Sn) + 50% Lead (Pb)
Packaging Specification: 25kg/carton
Country/Region of Origin: China/Ningbo
Industry Certification: ISO9001
Product Applications: Low-melting-point solder, suitable for wave soldering
or manual dip soldering. Used in high-end electronic product manufacturing.
Product Features: Excellent wettability to reduce defective solder joints.
Minimal harmful impurities to enhance diffusivity. Improved fluidity. Low dross
generation and good powdering property, with technical advantages in the
industry. Consistent quality and stable soldering performance.
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