HD Series – Powering High-Performance Computing

The HD Series is a next-generation silicon capacitor solution designed for high-performance electronic systems that demand ultra-compact footprint, high stability, and superior transient response. Built with advanced three-dimensional capacitor architecture and engineered dielectric materials, it delivers exceptional electrical performance in space-constrained applications.

As computing and processing power continue to scale, modern ICs such as CPUs, GPUs, and SoCs require increasingly efficient power delivery networks (PDN). The HD Series is developed to meet these challenges by providing ultra-high capacitance density and extremely low parasitic inductance within a miniaturized form factor.

Advanced Structural Design

Unlike conventional planar capacitor technologies, the HD Series adopts a vertically integrated 3D structure that significantly increases effective capacitance per unit area. This architecture reduces routing complexity on the PCB while improving electrical performance at high switching frequencies.

Combined with optimized dielectric formulation, the structure ensures stable operation under fast transient load conditions and minimizes energy loss during high-speed switching events.

Electrical Performance Highlights

The HD Series offers a balanced combination of high capacitance density and ultra-low parasitic parameters, making it suitable for high-frequency decoupling and power smoothing applications.

Key performance characteristics include:

• Capacitance density ranging from 0.35 to 2 μF/mm²

• Ultra-low equivalent series inductance (ESL), typically below 20 pH

• Operating voltage range from 1.5 V to 4.5 V DC

• Flexible, customized package configurations for system integration

These parameters make the HD Series particularly effective in environments where power integrity and signal stability are critical.

Application Scenarios

The HD Series is engineered for advanced electronic systems requiring compact and efficient power delivery solutions, including:

• Power delivery networks (PDN) for CPUs, GPUs, and SoCs

• DDR memory power stabilization

• Integrated voltage regulator (IVR) modules

• Advanced semiconductor packaging and heterogeneous integration

• High-speed digital computing platforms

By reducing the number of discrete passive components required on the PCB, the HD Series helps simplify board design while improving overall electrical performance.

Engineering Benefits

In modern system architectures, minimizing parasitic effects and optimizing space utilization are essential. The HD Series addresses these needs by offering:

• Higher capacitance in significantly reduced footprint

• Improved high-frequency decoupling capability

• Enhanced transient load response for dynamic processing workloads

• Reduced PCB component count and simplified layout design

• Compatibility with next-generation packaging technologies

These advantages contribute directly to improved system efficiency, thermal behavior, and power stability.

Customization Capability

To meet diverse application requirements, the HD Series supports flexible customization, including array configuration, capacitance scaling, and package adaptation. This allows system designers to optimize performance based on specific power architecture needs and integration constraints.